Dr. Wilhelm Kühn, Zeiss Oberkochen
Key bottleneck equipment to pattern the resist on the Si wafer is the lithography scanner. Dutch machine specialist ASML in tight cooperation with German optics specialist ZEISS developed EUV lithography and achieved market dominance over the recent decades. Leading edge chip manufacturing depends crucially on these EUV lithography machines.
Manufacturing of EUV optics requires highly sophisticated optical metrology and coating techniques in particular. A short overview will be given over interferometric measurement principles and current technological challenges. Furthermore an impression of size, the collaboration network and future of the EUV program will be conveyed.
If you are interested, but not an institute member: Please contact Ute.Schlichting@mbi-berlin.de to get the login dates for this event.